Note: This is a daily stock update and the information stands true as of 19/11/24, 09:00 CET.
Company Update:
BE Semiconductor Industries develops, manufactures and sells semiconductor packaging equipment. Packaging for semiconductors refers to the process of enclosing and protecting a semiconductor device (like an integrated circuit or microchip) after it has been fabricated. This involves creating a physical container or housing for the device to ensure it can connect to the outside world (e.g., circuit boards) and be protected from physical damage, environmental factors, and electrical interference.
Besi is the leading assembly equipment with more 35% of the addressable market share.
Their hybrid bonding offers attractive prospects and should fuel growth for the next few years.
Expert Opinion:
At first glance, Besi looks like an attractive play in semiconductors with strong growth prospects. Of course the current environment for semiconductors is less flamboyant but the prospects for Besi look attractive. Stock trades with a PE24 of 45.6x down to €22x for 2026.
I’ll go through the initiation coverage to have a more informed opinion of the potential for Besi but this looks like an attractive equity story.
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