Note: This is a daily stock update and the information stands true as of 13/06/25, 09:00 CET.
Company Update:
The 2025 Investor Day of BE Semiconductor Industries (BESI) confirmed that hybrid bonding is set to become the foundational technology in advanced semiconductor packaging, especially as leading-edge players like NVIDIA, AMD, Intel, Broadcom, and major hyperscalers are pivoting towards 3D integration.
Bessi also increased its long-term financial forecasts.
Long-term financial revenue: €1.5bn-€1.9bn vs €1bn + previously.
Gross margin: 64%-68% vs 62%-66%.
EBIT margin 40%-55% vs 35-50% previously.
Expert Opinion:
Besi offers an attractive profile with strong positions in hybrid bonding which is increasingly seen as the future of semiconductors. The CMD confirmed those strong prospects. However, even though he is a fan of the technology, our analyst believes that these very strong prospects are already priced in over the short term and there is little upside especially as some headwinds from the mobile sector will impact the demand over the short term. In long term, the prospects of Besi remain very strong. Please contact our sales team if you want to know more about Besi and hybrid bondings.
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